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Uncover Advanced Packaging technology: The hero behind the semiconductor industry innovation!
The popularity of a technology has historical reasons and cannot be separated from the promotion of famous companies - SiP technology is popularized by Apple, and advanced packaging technology has attracted public attention because of TSMC.
Rise to prominence
The semiconductor industry is on the cusp of technological innovation, revolutionizing applications as diverse as artificial intelligence (AI), 5G communications, and high performance computing (HPC). With the advent of the era of generative artificial intelligence, the demand for more powerful, compact, and efficient electronic devices continues to grow. In this quest, advanced packaging has become a key enabler, especially at the end of the Moore's Law era.
Redefining semiconductor technology
Advanced Packaging (AP) refers to a series of innovative technologies used to package integrated circuits (ics) to improve performance. These technologies are mainly divided into two categories: one is based on the XY plane extension of advanced packaging technology, mainly through RDL (packaged line) signal extension and interconnection; The second is an advanced packaging technology based on Z-axis extension, mainly through TSV (through-silicon hole) signal extension and interconnection. The former represents 2D advanced packages such as FOWLP and FOPLP, while the latter represents 3D packages such as SoIC and Foveros. At present, there is also a 2.5D package with both packaging characteristics, such as CoWoS and EMIB.
The packaging of semiconductor devices has undergone several major innovations:
The first time: In the 1980s, the transition from pin-in packages to surface patch packages greatly improved the assembly density on printed circuit boards.
The second time: in the 1990s, with the rise of spherical matrix packaging, it met the market demand for high pins and improved the performance of semiconductor devices.
Now, we are in the era of the third major innovation, which includes technologies such as chip-level packaging and system packaging designed to minimize the packaging area.
Enter four packaging stages:
Nude mount: The connection method represented is lead bonding.
Inverted package: The representative connection is a welding ball or convex point.
Wafer-level package: The connection method represented is RDL (Rewiring layer) technology.
2.5D/3D package: The connection modes represented are TSV (through-silicon) technology and Chiplet packaging technology.
Advantages of advanced packaging
What are the advantages of Advanced vs. traditional packaging?
The benefits of advanced packaging are reflected in increased processing efficiency, reduced design costs, and higher density integration. These technologies not only shorten the production cycle, but also reduce the area wasted, which improves performance and efficiency. They mark a new era in semiconductor packaging and provide new impetus for future technological innovations. In the evolution of the semiconductor industry, advanced packaging has become a key enabler, promising to shape the future of more powerful, compact, and efficient electronic devices.
Advanced packaging represents a series of innovative technologies that are reshaping the face of semiconductor packaging. In recent years, advanced packaging technology has shown explosive growth, and every related technology company is registering trademarks, such as TSMC's InFO, CoWoS, ASE's FoCoS, Amkor's SLIM, SWIFT, and so on. Although there may be only minor differences between these technologies, they meet the needs of customized products, making the semiconductor packaging field full of diversity.
New product
In the ongoing evolution of the semiconductor industry, advanced packaging technology has become a key enabler, not only improving the performance of electronic devices, but also reducing production costs. In this area, let's introduce a new product revamped by the Esdaq team, the i-Stock semi magazine stocker, a forward-thinking solution specifically designed to house die chips and Lead Frame lead frames.
Product advantage
In the context of increasing competition in the semiconductor industry,
The launch of the i-Stock semi magazine stocker will provide semiconductor manufacturers with more competitiveness and help enable more efficient and innovative semiconductor packaging processes. This product represents a giant leap forward in technology and production for the semiconductor industry, heralding a more dynamic and opportunity future!
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